E. Rosolymou, S. Spanou, S. Hansal, W. Hansal, E.A. Pavlatou
COST WORKSHOP “Electrochemical processing and corrosion of miniaturized systems” (2016), 12-14 October, Athens (oral)
Copper nanowires were fabricated by filling commercial AAO nanochannels by utilizing Direct and Pulse Current Electrodeposition. Uniform Cu nanowires were produced by using acidic copper baths at room temperature under specific pulse plating conditions. X‐ray diffraction revealed the effect of pulse plating parameters on the crystalline structure of the Cu nanowires and Field Emission Microscopy was used to examine the pore filling of the template.